1. Overview of Equipment and Application Fields

The PT500 Plasma Cleaner is a multifunctional dry surface treatment system specifically designed for advanced material science research, microelectronics manufacturing, and biomedical engineering. Utilizing the principle of radio frequency (RF) glow discharge, this equipment excites process gases (such as oxygen, argon, hydrogen, and carbon tetrachloride) into high-energy plasma states under vacuum conditions. These active particles (ions, electrons, and free radicals) can undergo physical bombardment or chemical reactions with material surfaces, thereby achieving multiple functions including ultra-fine cleaning, surface activation, micro-etching, and pre-treatment for thin film deposition.

The PT500 eliminates the pollution from chemical waste and drying challenges associated with traditional wet cleaning methods, offering an eco-friendly, efficient, and non-destructive solution. Its core advantage lies in its ability to thoroughly clean microscopic pores, removing invisible organic contaminants (such as grease, fingerprints, and photoresist residues). By introducing polar groups, it significantly enhances material surface energy, thereby markedly improving subsequent coating, bonding, printing, or plating processes.

Widespread application areas:

· Semiconductors and Microelectronics: Wafer Demealing, Lead Frame Cleaning, Pre-encapsulation Surface Treatment, PCB Soldering and Activation.

· Biomedical: Surface hydrophilization treatment of medical devices (catheters, stents), modification of cell culture dishes, and cleaning of biosensor chips.

· New energy battery: Lithium battery electrode surface degreasing, separator hydrophilicity improvement, fuel cell bipolar plate cleaning.

· Optics and Display: Lens module cleaning, OLED/LCD substrate activation, and optical film pretreatment.

· Polymer materials: Pre-treatment of plastics, rubbers, ceramics, and glass to enhance adhesive bonding.

· Scientific experiments: Nanomaterial synthesis precursor treatment, catalyst carrier modification, microfluidic chip channel modification.

2. Core Functional Highlights

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high efficiency radio frequency plasma source

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o Stable glow discharge: Equipped with a high-performance 40kHz or 13.56MHz RF power supply (frequency varies by configuration), it generates uniform and stable glow plasma even under low gas pressure.

o Multimodal processing: Supports **physical bombardment (Ar gas) and chemical reaction (O₂/H₂ gas)** mechanisms. Physical bombardment can remove stubborn particles and oxide layers, while chemical reaction converts organic pollutants into volatile CO₂ and H₂O for atom-level cleaning.

o Stepless power adjustment: The output power can be continuously adjusted within the range of 0-500W (or specific rated values). Users can precisely control the plasma intensity according to material tolerance and processing requirements, preventing thermal damage or excessive etching.

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Precision Vacuum and Airflow Control System

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o High-speed vacuum unit: Equipped with a high-performance mechanical vacuum pump, capable of achieving ultimate vacuum levels below 10Pa (depending on pump configuration), ensuring rapid attainment of the required low-pressure environment in the reaction chamber.

o Digital vacuum gauge: Equipped with high-precision capacitive film gauge or Pirani gauge, it displays chamber pressure in real time with an accuracy of ±1%, ensuring process repeatability.

o Mass Flow Control (MFC): Featuring optional multi-channel mass flow meters, it enables precise regulation of process gas inflow (with sccm-level accuracy) for oxygen, argon and other gases, ensuring accurate replication of complex mixed gas processes.

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Humanized intelligent operation interface

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o PLC Intelligent Control: Featuring industrial-grade PLC controllers with a high-definition touch screen human-machine interface (HMI), this system enables users to intuitively set and monitor critical parameters including evacuation time, intake flow rate, processing power, and processing duration.

o Process Formula Storage: The system supports storing over 50 commonly used process formulas, enabling one-click retrieval to streamline workflows and minimize human errors, making it ideal for small-batch experiments with multiple product varieties.

o Automated operation: Features a fully automated mode that automatically completes the entire process from vacuum extraction, gas charging, ignition to exhaust and shutdown, requiring no human intervention.

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Safe and durable design

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o Visual observation window: The chamber is equipped with a high-strength, high-pressure-resistant quartz observation window, facilitating real-time monitoring of plasma color and state to assess the reaction progress.

o Multiple safety protections: The system is equipped with overcurrent protection, overheat protection, vacuum interlock protection, and access control safety switches. When the cabin door is not closed or the vacuum level is abnormal, the system automatically prohibits high-voltage startup to ensure the safety of personnel and equipment.

o Corrosion-resistant chamber: The reaction chamber is constructed from high-grade stainless steel (SUS304/316) or anodized aluminum, featuring smooth and easy-to-clean inner walls that resist corrosion from various corrosive gases, thereby extending the equipment's service life.

3. Technical Parameters and Specifications

4. Detailed Explanation of Typical Application Scenarios

Semiconductor packaging and testing:

o Removal of adhesive and cleaning: to remove the residual photoresist, flux and organic contaminants after wafer cutting, improving the yield.

o Pre-bonding lead frame treatment: Activates the lead frame surface, removes oxide layers, significantly enhances gold/copper wire bonding strength, and reduces false soldering.

biomedical engineering ：

o Hydrophilization treatment: Oxygen plasma treatment is applied to hydrophobic polymer materials (such as PDMS, PE, PP) to introduce polar groups like-OH and-COOH, reducing the contact angle from>90° to <10°, which significantly improves cell adhesion growth performance or drug solution infiltration.

o Sterilization and cleaning of medical devices: Under conditions without high temperature and high pressure, low-temperature plasma can effectively eliminate bacterial spores and remove trace organic residues on the surface of surgical instruments.

New energy battery manufacturing:

o Electrode cleaning: removes rolling oil and dust from the electrode surface, reduces interfacial impedance, and extends battery cycle life.

o The surface roughness and porosity of the separator are increased by plasma etching, and the electrolyte infiltration rate is enhanced.

Optics and Precision Optics:

o Pre-coating cleaning: Before applying anti-reflective (AR) or reflective coatings, thoroughly remove fingerprints, oils, and particles from the lens surface to prevent coating detachment or pitting, thereby enhancing optical performance.

o Lens bonding: Activating the lens mount and surface to enhance the adhesion strength of UV-curing or epoxy adhesives, ensuring the reliability of optical components under extreme conditions.

Polymer material processing:

o Pre-treatment for printing and coating: Surface activation of plastic films and rubber parts to resolve issues of poor ink adhesion and coating peeling, eliminating the need for primers (Primer), which is environmentally friendly and cost-effective.

o Injection-molded parts bonding: A pre-treatment method for automotive interior components and smartphone casings, replacing traditional flame treatment or chemical etching. It ensures more uniform results and eliminates deformation risks.

5. Why choose the PT500 plasma cleaner?

The PT500 plasma cleaner has become the preferred equipment for laboratories and pilot production lines, thanks to its outstanding cleaning performance, flexible process adaptability, and exceptional cost-effectiveness. It not only addresses the pain points of traditional wet cleaning methods—such as difficulty in reaching microstructures, potential secondary contamination, and drying challenges—but also meets increasingly stringent EHS standards through its dry environmental process. With a wide power adjustment range of 0-500W and multi-gas compatibility, it can handle various material challenges from soft polymers to hard ceramics. The intelligent PLC control system ensures traceability of experimental data and high process repeatability. Whether for fundamental surface science mechanism research or process validation in new product development, the PT500 provides precise, reliable, and efficient surface modification solutions. Choosing the PT500 means choosing the future of cleaning technology, helping you create macroscopic value in the microscopic world and drive qualitative leaps in product performance.